Advanced Packaging Process Control Software Market to Reach USD 5.5 Billion by 2036 at 15.3% CAGR
Camtek received a USD 31 million multi-system order from a leading OSAT on March 30, 2026, with the systems intended for CoWoS-like advanced packaging applications. The order highlights the growing need for inspection and process-control capabilities as semiconductor manufacturers handle more complex 2.5D and 3D packages.The development comes as demand for advanced packaging process control...
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