What is Flip Chip Package Technology? Components, Working, Advantages and Inspection Flip chip package technology is a semiconductor packaging method where the active side of a chip faces the substrate. Conductive bumps create electrical and mechanical connections between them. Unlike wire bonding, it does not use wire loops between the die and substrate. The approach supports high-density interconnections and compact packages. It is widely used where electrical performance, space, thermal behavior, and connection density are important. Read more: https://viewmm.com/en/flip-chip-package-technology/